Item talk:Q168347

{

 "OpenAlex": {
   "display_name": "Three-Dimensional Integrated Circuits",
   "description": "This cluster of papers focuses on the advancements, challenges, and technologies related to Three-Dimensional Integrated Circuits (3D ICs), with a particular emphasis on Through-Silicon Via (TSV) technology, interconnect design, wafer bonding techniques, thermal management strategies, and system integration. The research spans from electrical modeling and microarchitecture to heterogeneous integration and chip stacking.",
   "keywords": [
     "Through-Silicon Via",
     "Interconnect",
     "Wafer Bonding",
     "Thermal Management",
     "System Integration",
     "TSV Technology",
     "Microarchitecture",
     "Heterogeneous Integration",
     "Electrical Modeling",
     "Chip Stacking"
   ],
   "ids": {
     "openalex": "https://openalex.org/T11527",
     "wikipedia": "https://en.wikipedia.org/wiki/Three-dimensional_integration"
   },
   "subfield": {
     "id": "https://openalex.org/subfields/2208",
     "display_name": "Electrical and Electronic Engineering"
   },
   "field": {
     "id": "https://openalex.org/fields/22",
     "display_name": "Engineering"
   },
   "domain": {
     "id": "https://openalex.org/domains/3",
     "display_name": "Physical Sciences"
   },
   "updated_date": "2024-08-12T06:07:42.606848",
   "created_date": "2024-01-23",
   "type": "topic",
   "oa_id": "T11527",
   "id": "https://openalex.org/T11527"
 }

}