Item talk:Q167555

{

 "OpenAlex": {
   "display_name": "Chemical Mechanical Polishing in Microelectronics Manufacturing",
   "description": "This cluster of papers focuses on the techniques, mechanisms, and simulations related to chemical mechanical polishing (CMP) in the context of microelectronics manufacturing. It covers topics such as material removal mechanisms, molecular dynamics simulation, ultra-precision grinding, surface and subsurface damage, nanometric cutting, magnetorheological finishing, polishing slurry chemistry, and tool wear.",
   "keywords": [
     "Chemical Mechanical Planarization",
     "Material Removal Mechanism",
     "Molecular Dynamics Simulation",
     "Ultra-Precision Grinding",
     "Surface Damage",
     "Nanometric Cutting",
     "Magnetorheological Finishing",
     "Subsurface Damage",
     "Polishing Slurry Chemistry",
     "Tool Wear"
   ],
   "ids": {
     "openalex": "https://openalex.org/T11301",
     "wikipedia": "https://en.wikipedia.org/wiki/Chemical-mechanical_planarization"
   },
   "subfield": {
     "id": "https://openalex.org/subfields/2204",
     "display_name": "Biomedical Engineering"
   },
   "field": {
     "id": "https://openalex.org/fields/22",
     "display_name": "Engineering"
   },
   "domain": {
     "id": "https://openalex.org/domains/3",
     "display_name": "Physical Sciences"
   },
   "updated_date": "2024-07-01T05:20:24.042780",
   "created_date": "2024-01-23",
   "type": "topic",
   "oa_id": "T11301",
   "id": "https://openalex.org/T11301"
 }

}