Three-Dimensional Integrated Circuits (Q168347)
From geokb
3D ICs and chip stacking technologies for improved performance.
- Through-Silicon Via
- Interconnect
- Wafer Bonding
- Thermal Management
- System Integration
- TSV Technology
- Microarchitecture
- Heterogeneous Integration
- Electrical Modeling
- Chip Stacking
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Three-Dimensional Integrated Circuits |
3D ICs and chip stacking technologies for improved performance. |
|
