Chemical Mechanical Polishing in Microelectronics Manufacturing (Q167555)
From geokb
This cluster of papers focuses on the techniques, mechanisms, and simulations related to chemical mechanical polishing (CMP) in the context of microelectronics manufacturing
- Chemical Mechanical Planarization
- Material Removal Mechanism
- Molecular Dynamics Simulation
- Ultra-Precision Grinding
- Surface Damage
- Nanometric Cutting
- Magnetorheological Finishing
- Subsurface Damage
- Polishing Slurry Chemistry
- Tool Wear
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Chemical Mechanical Polishing in Microelectronics Manufacturing |
This cluster of papers focuses on the techniques, mechanisms, and simulations related to chemical mechanical polishing (CMP) in the context of microelectronics manufacturing |
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