Three-Dimensional Integrated Circuits (Q168347): Difference between revisions

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(‎Changed an Item: moved OpenAlex ID to its dedicated external ID datatype for consistency)
(‎Changed label, description and/or aliases in en, and other parts: removed aliases from OpenAlex keywords)
 
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Through-Silicon Via
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Interconnect
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Wafer Bonding
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Thermal Management
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System Integration
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TSV Technology
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Microarchitecture
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Heterogeneous Integration
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Electrical Modeling
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Chip Stacking

Latest revision as of 20:48, 12 September 2024

3D ICs and chip stacking technologies for improved performance.
Language Label Description Also known as
English
Three-Dimensional Integrated Circuits
3D ICs and chip stacking technologies for improved performance.

    Statements

    OpenAlex ID
    T11527
    0 references
     
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