Chemical Mechanical Polishing in Microelectronics Manufacturing (Q167555): Difference between revisions

From geokb
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Chemical Mechanical Planarization
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Material Removal Mechanism
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Molecular Dynamics Simulation
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Ultra-Precision Grinding
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Surface Damage
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Nanometric Cutting
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Magnetorheological Finishing
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Subsurface Damage
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Polishing Slurry Chemistry
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Tool Wear
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Property / same as: https://openalex.org/T11301 / rank
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Property / OpenAlex ID
 
Property / OpenAlex ID: T11301 / rank
 
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Latest revision as of 20:40, 12 September 2024

Advanced polishing techniques in microelectronics manufacturing to achieve precise surface finish and minimize material removal damage.
Language Label Description Also known as
English
Chemical Mechanical Polishing in Microelectronics Manufacturing
Advanced polishing techniques in microelectronics manufacturing to achieve precise surface finish and minimize material removal damage.

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