Chemical Mechanical Polishing in Microelectronics Manufacturing (Q167555): Difference between revisions

Latest revision as of 20:40, 12 September 2024

Advanced polishing techniques in microelectronics manufacturing to achieve precise surface finish and minimize material removal damage.

Language	Label	Description	Also known as
English	Chemical Mechanical Polishing in Microelectronics Manufacturing	Advanced polishing techniques in microelectronics manufacturing to achieve precise surface finish and minimize material removal damage.

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@@ aliases / en / 0 / aliases / en / 0 @@
-Chemical Mechanical Planarization
@@ aliases / en / 1 / aliases / en / 1 @@
-Material Removal Mechanism
@@ aliases / en / 2 / aliases / en / 2 @@
-Molecular Dynamics Simulation
@@ aliases / en / 3 / aliases / en / 3 @@
-Ultra-Precision Grinding
@@ aliases / en / 4 / aliases / en / 4 @@
-Surface Damage
@@ aliases / en / 5 / aliases / en / 5 @@
-Nanometric Cutting
@@ aliases / en / 6 / aliases / en / 6 @@
-Magnetorheological Finishing
@@ aliases / en / 7 / aliases / en / 7 @@
-Subsurface Damage
@@ aliases / en / 8 / aliases / en / 8 @@
-Polishing Slurry Chemistry
@@ aliases / en / 9 / aliases / en / 9 @@
-Tool Wear
@@ description / en / description / en @@
-This cluster of papers focuses on the techniques, mechanisms, and simulations related to chemical mechanical polishing (CMP) in the context of microelectronics manufacturing
+Advanced polishing techniques in microelectronics manufacturing to achieve precise surface finish and minimize material removal damage.
@@ Property / same as @@
-https://openalex.org/T11301
@@ Property / same as: https://openalex.org/T11301 / rank @@
-Normal rank
@@ Property / OpenAlex ID @@
+T11301
@@ Property / OpenAlex ID: T11301 / rank @@
+Normal rank