Chemical Mechanical Polishing in Microelectronics Manufacturing (Q167555): Difference between revisions
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Revision as of 12:20, 8 September 2024
Advanced polishing techniques in microelectronics manufacturing to achieve precise surface finish and minimize material removal damage.
- Chemical Mechanical Planarization
- Material Removal Mechanism
- Molecular Dynamics Simulation
- Ultra-Precision Grinding
- Surface Damage
- Nanometric Cutting
- Magnetorheological Finishing
- Subsurface Damage
- Polishing Slurry Chemistry
- Tool Wear
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Chemical Mechanical Polishing in Microelectronics Manufacturing |
Advanced polishing techniques in microelectronics manufacturing to achieve precise surface finish and minimize material removal damage. |
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